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Intel And German Government Sign Revised Letter Of Intent For Planned Wafer Fabrication

Intel Continues Investment in Germany

Intel and German Government Sign Revised Letter of Intent for Planned Wafer Fabrication

Magdeburg, Germany to be Home to Two New Semiconductor Fabs

Berlin, Germany - June 19, 2023 - Intel and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication facility in Magdeburg, Germany.

The renewed agreement reaffirms Intel's commitment to establish a balanced and resilient supply chain in Europe and demonstrates the company's confidence in Germany as a strategic location for its manufacturing operations.

In the initial phase, Intel plans to develop two first-of-their-kind semiconductor fabs in Magdeburg. These facilities will mark Intel's first use of high-volume EUV technology and the beginning of high-volume production of Intel 4 technology.


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